![Wafer Cleaving / Glass Breaking Pliers Automated AFM [124-65-2]](https://cdn.shopify.com/s/files/1/0036/0579/0831/products/Wafer_Cleaving_Glass_Breaking_Pliers_7295.jpg?v=1755635355)
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[124-65-2]
The amorphous Silicon Nitride Support Film is grown on a silicon wafer to the desired membrane thickness of 8
Leit-C-Plast™
Extra bars provide better support over a large area
Lacey Carbon Type-A: A Lacey carbon film with a removable Formvar backing on the opposite side of the grid
Wafer Cleaving / Glass Breaking Pliers Automated AFM [124-65-2]DESCRIPTION These light weight tweezers and pliers are non absorbent, have a positive, gentle grip, are non magnetic and the tips do not open when extra pressure is applied. They resist acetone, alcohol and most acids. Static dissipative (carbon fiber reinforced) versions are available for most models. Ideal for sample preparation, microscopy, etching, electronics, instrumentation, laboratories, forensics and delicate wafer handling. Especially useful
